Abstract
We report a method of converting non-conductive plastic surfaces into conductive by
plating either copper electroless or copper electroplating -carbon black containing
bending Agent onto Perspex plastics . Various approaches have been studied in order
to comparing properties of the plated copper for two methods such as scanning
electron microscopy (SEM),thickness, roughness, porosity, tensile Strength and
elongation. The results show that the surface of electroplating was uniform, compact,
and continuous and it had an obvious metallic sheen, while the surface of plated
copper for electroless for it had many pores. Also observed that the coating was
composed of small cells. These cells have been deposited together closely.
Thick copper layer was deposited a(38μm ) electroplating while (5μm) for electroless
plating tensile strength and elongation of copper electroplating became greater
compared with copper electroless, whereas the roughness and Porosity became
smaller.
The electroplating copper deposition process developed in this study may open up a
new route of plating on plastics (POP) for printed circuit boards, electromagnetic
interference shielding, and many other applications.
plating either copper electroless or copper electroplating -carbon black containing
bending Agent onto Perspex plastics . Various approaches have been studied in order
to comparing properties of the plated copper for two methods such as scanning
electron microscopy (SEM),thickness, roughness, porosity, tensile Strength and
elongation. The results show that the surface of electroplating was uniform, compact,
and continuous and it had an obvious metallic sheen, while the surface of plated
copper for electroless for it had many pores. Also observed that the coating was
composed of small cells. These cells have been deposited together closely.
Thick copper layer was deposited a(38μm ) electroplating while (5μm) for electroless
plating tensile strength and elongation of copper electroplating became greater
compared with copper electroless, whereas the roughness and Porosity became
smaller.
The electroplating copper deposition process developed in this study may open up a
new route of plating on plastics (POP) for printed circuit boards, electromagnetic
interference shielding, and many other applications.
Keywords
Copper electroless
Electroplating methods
Methods of copper deposition.
Non-conductive surface plating