Abstract
The performance of electronic devices, especially computers,
depends on the efficiency of the electronic chips and Computer
processing units, which are mainly made of semiconductors, so
their working efficiency is inversely proportional to their
working temperature. Therefore, this paper presents an
experimental investigation of the design, implementation, and
testing of three cooling systems to maintain the temperature of
the processing unit as minimum as possible. The first is a
traditional system dissipates heat from the working fluid to the
air through a finned tube heat exchanger. The second
successive hybrid system was designed to integrate with the
first one in addition to a thermoelectric cooling system to cool
the working fluid. The third system included in addition to the
traditional heat dissipation one, an intercooler cylinder with a
large quantity of the working fluid in the main system beside a
separate system for cooling the working fluid using
thermoelectric cooling to ensure sufficient cooling of the
processing units when working at high frequencies by
providing a large capacity of working fluid pre-cooled to a low
temperature. Comparing the experimental results of the
cooling systems with the traditional one under the same test
conditions showed that the second system led to a reduction in
the temperature of the processing unit by 5.2%, while
employing the third system reduced the temperature to
11.3%., When the thermoelectric cooling unit operates at a
performance factor of about 1.76.
depends on the efficiency of the electronic chips and Computer
processing units, which are mainly made of semiconductors, so
their working efficiency is inversely proportional to their
working temperature. Therefore, this paper presents an
experimental investigation of the design, implementation, and
testing of three cooling systems to maintain the temperature of
the processing unit as minimum as possible. The first is a
traditional system dissipates heat from the working fluid to the
air through a finned tube heat exchanger. The second
successive hybrid system was designed to integrate with the
first one in addition to a thermoelectric cooling system to cool
the working fluid. The third system included in addition to the
traditional heat dissipation one, an intercooler cylinder with a
large quantity of the working fluid in the main system beside a
separate system for cooling the working fluid using
thermoelectric cooling to ensure sufficient cooling of the
processing units when working at high frequencies by
providing a large capacity of working fluid pre-cooled to a low
temperature. Comparing the experimental results of the
cooling systems with the traditional one under the same test
conditions showed that the second system led to a reduction in
the temperature of the processing unit by 5.2%, while
employing the third system reduced the temperature to
11.3%., When the thermoelectric cooling unit operates at a
performance factor of about 1.76.
Keywords
Hybrid Cooling system Intercooling cylinders Thermoelectric cooler Central processor unit Graphical processor unit